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ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release
ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release
ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release
ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release
ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release
ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release
ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release

ASUS ROG STRIX Z690-F GAMING WIFI, Intel Z690 LGA 1700 ATX motherboard, PCIe®5.0, 16+1 power stages, DDR5, WiFi 6E, Intel®2.5 Gb LAN, four M.2, M.2 backplate, PCIe®Slot Q-Release

Regular price
R 10,542.29
Regular price
Sale price
R 10,542.29
Terms & conditions
Details
  • Brand: ASUS
  • Type: Electronics
  • Availability: In Stock
Description

, Optimal power solution: 16+1 power stages with 8+8 ProCool II power connectors, high-quality alloy chokes and durable capacitors to support multi-core processors , Gaming connectivity: Supports HDMI 2.1 and DisplayPort 1.4 output, four M.2 slots, as well as USB 3.2 Gen 2x2 Type-C , Intelligent control: ASUS AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation to simplify setup and improve performance , Optimized thermal design: Integrated I/O cover and VRM heatsinks with high conductivity thermal pad, L-shaped heatpipe, four onboard M.2 heatsinks and M.2 backplate for the M.2_1 slot ,›

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